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ATS015015022-MF-4U - 15.00 x 15.00 x 22.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

ATS015015022-MF-4U_6415838.PDF Datasheet


 Full text search : 15.00 x 15.00 x 22.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin


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FDZ4670 N-Channel PowerTrench?MOSFET BGA 30V, 25A, 2.5mΩ
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IBM25PPC740L-GB300A2R IBM25PPC740L-GB350A2R IBM25P 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 350 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 375 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 333 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
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Advanced Interconnections
K7P401811M-HC160 K7P403611M-HC200 K7P403611M 128Kx36 & 256Kx18 Synchronous Pipelined SRAM Data Sheet
128K X 36 STANDARD SRAM, 2.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
Samsung Electronic
TSC51C2XXX-12IB TSC51C2XXX-16IB TSC51C2XXX-A12IB T IC MAX 7000 CPLD 512 208-PQFP
IC MAX IIZ CPLD 570 LE 256-MBGA
IC MAX 7000 CPLD 512 256-FBGA
484-pin FineLine BGA RoHS Compliant: Yes
956-pin BGA RoHS Compliant: Yes
IC,FPGA,32470-CELL,CMOS,BGA,1020PIN,PLASTIC
FPGA Logic IC Logic Type:FPGA; No. of Macrocells:726; Package/Case:1020-BGA; Leaded Process Compatible:No; Number of Circuits:32;
IC,FPGA,4800-CELL,CMOS,BGA,484PIN,PLASTIC
IC,FPGA,10570-CELL,CMOS,BGA,672PIN,PLASTIC
IC,FPGA,14400-CELL,CMOS,BGA,780PIN,PLASTIC
No. of Macrocells:192; No. of Pins:68; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes;
No. of Macrocells:192; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes;
No. of Macrocells:160; No. of Pins:84; Operating Temp. Max:70 C; Operating Temp. Min:0 C; Propagation Delay:10ns RoHS Compliant: Yes;
No. of Macrocells:440; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:9ns RoHS Compliant: Yes;
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IC MAX 7000 CPLD 160 84-PLCC 8位微控制
TE Connectivity, Ltd.
Diodes, Inc.
Semtech, Corp.
IBM25PPC740-DB0M2660 IBM25PPC740-EB0M2660 IBM25PPC 32-BIT, 266 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 233 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
Japan Aviation Electronics Industry, Ltd.
FDZ294N N-Channel 2.5V Specified PowerTrench® BGA MOSFET
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Fairchild Semiconductor
UPD44325084F5-E37-EQ2-A UPD44325084F5-E50-EQ2-A UP 4M X 8 QDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165
4M X 8 QDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, PLASTIC, BGA-165
NEC, Corp.
FDZ2553NZ Monolithic Common Drainl N-Channel 2.5V Specified PowerTrench BGA MOSFET
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FAIRCHILD[Fairchild Semiconductor]
K7P401822B-HC16 K7P401822B-HC20 K7P401822B-HC25 K7 SENSOR DIFF VACUUM GAGE 10 H2O 128K × 36
128Kx36 & 256Kx18 Synchronous Pipelined SRAM 128K × 36
256K X 18 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119
128K X 36 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119
256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, BGA-119
SENSOR DIFF VACUUM GAGE 1PSI
SENSOR ABSOLUTE 0-15PSIA
128Kx36 & 256Kx18 Synchronous Pipelined SRAM
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
IBM25PPC405EP-3GA133C IBM25PPC405EP-3GA200C IBM25P 32-BIT, 133.33 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385
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32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385
Electronic Theatre Controls, Inc.
IS61NVP51236-250B2I IS61NVP102418-250B2I IS61NVP10 512K X 36 ZBT SRAM, 2.6 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
1M X 18 ZBT SRAM, 2.6 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
1M X 18 ZBT SRAM, 3.1 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
Integrated Silicon Solution, Inc.
 
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